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IEEE Buenaventura
July 2018 Newsletter

In This Issue

Local IEEE Events

  Jul 19: Mars Helicopter TelecomHub101
  Jul 24: Advanced IC Packaging Solutions and Reliability ChallengesSkyworks, Lawrence Drive
  Aug 1: IEEE Buenaventura Summer Mixer: Our Free Will vs. Artificial IntelligenceHub101

Job Opportunities and Sponsors

  Advanced Personnel ProfilesStaffing & Recruiting Since 1995
  Syntesis GlobalManagement Consulting
  Ameriprise FinancialD. F. Rick Speidel, Financial Advisor

Local IEEE Events

July 19, 2018
Mars Helicopter Telecom
6:30 PM

Speaker: Courtney Duncan
Meetings are free and open to the public.

Abstract

Mars Helicopter is the first attempt at aerial flight on a planet other than earth. It is slated to go to Mars with the 2020 Rover. The air near the surface of Mars is extremely thin and cold, making it a significant engineering challenge to bear the overall vehicle mass, and stay warm enough to survive, on a limited power budget. The telecom subsystem shares these constraints, while providing a radio frequency tether to the rover, in support of five planned demonstration sorties. This talk is an overview of the Mars Helicopter Mission and the Telecom subsystem implementation.

About the Speaker

Courtney Duncan has worked on the Space Transportation System Ku-Band communications system, the Rouge family of science grade GPS receivers, the Space Interferometry Mission Microsecond ArcSecond Testbed, MONTE for deep space navigation, the Shuttle Radar Topography mission, GRAIL, the SCaN TestBed, and the Iris CubeSat compatible deep space transponder. He currently manages the reprogrammable Signal Processing Group (337G), and leads the telecom team for the Mars Helicopter.

Location

Hub101
Cal Lutheran Center for Entrepreneurship
31416 Agoura Road
Westlake Village, CA 91361
(map)

Presented by: IEEE Buenaventura Aerospace and Electronic Systems, and Microwave Theory and Techniques chapters

Flyer (PDF)


July 24, 2018
Advanced IC Packaging Solutions and Reliability Challenges

Pizza/Refreshments: 6:30 PM
Presentation: 7:00 PM
Speaker: Richard Rao
Free admission. Register at www.ieee-bv.org/meet/2018-07-edcas

Abstract

This talk provides an introduction of most advanced IC packaging solutions and related reliability challenges. It covers 3D/2.5D/2.1D and FanOut WLP packaging integration, advanced interconnects such as TSV (Through Si Via) /uBumps, Si Interposer, Cu Pillar and Cu/Cu direct bonding related failure modes, and finally the Chip to Package Interaction (CPI) issues on 16 nm and beyond FinFET nodes.

About the Speaker

Dr. Richard Rao is currently a Technical Fellow of Microsemi, a Microchip Company, a leading supplier of high reliability integrated circuits, located in Southern California and a Senior Member of IEEE. He is the present Chair of IEEE EPS (Electronics Packaging Society) Reliability Technical Committee. Dr. Rao is responsible for the corporate reliability and advanced packaging solutions. His focus is to find advanced packages to meet the high performance, high reliability and high-power semiconductor ICs; to study the new failure modes and mechanisms of cutting edge silicon and packaging technologies as well as to develop design for reliability solutions for advanced circuits, packaging and chip to package interaction. He has a Ph.D. degree in solid mechanics of materials from the University of Science and Technology of China. Prior to joining Vitesse Semiconductor Corp (now Microsemi) in 2004, Dr. Rao held various academic and technical positions in reliability physics and engineering. He was an associate professor at University of Science and Technology of China, a research fellow at Northwestern University, a National Science and Technology Board Research Fellow in Singapore; and a principal engineer at Ericsson Inc. He has published over 30 papers on reliability physics and applications and he is a main contributor of several JEDEC standards. He is a technical committee member of IRPS (International Reliability and Physics Symposium) and ECTC (Electronics Component and Technology Conference). He is a frequent speaker to IRPS, ECTC, ISQED (International Symposium on Quality Electronics Design), ASME Symposiums and a keynote speaker to ICEPT and International Conf on System on Chip, etc. Dr. Rao has over 20 years hands on experience and knowledge in silicon to package to system integration such as HKMG and FinFET, high performance FCBGA/CSP, WLP, 2.5D/3D, chip to package to board interaction, board and system level reliability physics and applications. He was invited to give keynote speech and tutorials on several international conferences.

Location

Skyworks Solutions
649 Lawrence Drive
Newbury Park, CA  91320
(Not the main building; please use link to arrow that pinpoints building)

Presented by: IEEE Buenaventura Electron Devices/Circuits and Systems Chapter

Flyer (PDF)


August 1, 2018
IEEE Buenaventura Summer Mixer: Our Free Will vs. Artificial Intelligence
A Panel Discussion with Technical Experts

Complementary Buffet opens at 6:30 PM
Panel Discussion/Q&A starts shortly after 7:00 PM
Event is free of charge, but pre-registration is requested to help us plan appropriately.
Register at www.ieee-bv.org/meet/2018-08-mixer

Abstract

How do we preserve our own voice and freedom of decision when big data “reads us” and gives unsolicited advice? Does artificial Intelligence manipulate our power of decision? Furthermore, recent research showed that algorithms may have kept some human biases that were involuntarily embedded at time of programming? This Summer event will be Q&A between the audience and a panel of guest experts in artificial intelligence, sensing, imaging, internet search engines and algorithms. Together, we will explore how to live in a smart environment while staying alert of the boundaries between our privacy and our connectivity.

Location

Hub101
Cal Lutheran Center for Entrepreneurship
31416 Agoura Road
Westlake Village, CA 91361
(map)

Presented by: IEEE Buenaventura Section

Flyer (PDF)

Sponsors

Advanced Personnel Profiles
Staffing & Recruiting Since 1995

Job Opportunities

Electronics Engineer
Commercial Company, Valencia, CA

Responsible for design and development of all aspects of electrical systems for new and existing products.  Analog and digital circuit design, analysis and test.  Minimum of 7 years experience in a regulated environment.  Hands-on in the lab.  Must have strong hardware experience.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com

Staff Software Engineer IV
Santa Barbara, CA

Thorough working knowledge and broad experience using C++, C#, MFC, STL, WPF, Windows .Net, and layered software systems using object-oriented design for the development of production level software tools and systems.  Deep interoperability experience for C#/C++ with COM/ATL and/or CLI.  Position requires 8+ years of experience in software engineering and development.   Prefer at least 5 years experience in control systems, robotics, digital signal processing, or instrumentation software development. Requires at least 5 years and broad experience in C++ and C# programming in Windows application development environment.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com

Staff Systems Engineer
Santa Barbara, CA

This position will work primarily on system requirements, architecture, design, development and integration with additional contributions to the detailed specification and creation of sub-assemblies.

Experience in the specification, design, and evaluation of precision positioning systems utilizing stepper motor, piezo and voice coil actuators with encoders and optical sensing methods.  Modeling and simulation using SolidWorks.  Experience in the characterization and testing of such precision motion systems and component parts using linear displacement interferometers and vibrometers.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com

Sr. Software Development Manager
San Jose, CA

Minimum of 10 years of experience in Windows application development using object-oriented techniques using MFC and .Net using multi-threaded programming.  Experience as a software architect or working on a software architecture team, providing technical leadership/guidance/mentorship.  At least 8 years of C/C++ programming experience.  Experience in motion control, digital signal processing, hardware interfaces, and interactive GUIs.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com

Staff Engineer, Software Development
San Jose, CA

Develop specialized analysis algorithms using image processing and 2D signal processing techniques.  Implement algorithms with professional quality C++ and/or C# code.

Strong background in image processing and 2D digital signal processing.  Experience with C# and/or C++ development for Windows desktop environment.  Matlab fluency, including image processing toolkit.  Minimum 5 years professional experience developing image processing algorithms and applications.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com

Sr. Quality Inspector
Second Sight Medical Products, Sylmar, CA

Medical device inspection experience required.  Must have proficiency with SmartScope.

Contact Pat Jacobs — 805-579-0630  pat.jacobs@advancedpersonnelprofiles.com


Syntesis Global
Management Consulting

Syntesis Global introduces the “New Standard” for Creating a Culture of Excellence in Leadership Development, Organizational Dynamics, Career Transitions and Outplacement Services: Syntesis Global™. With over thirty years of business experience, Syntesis Global™ offers state-of-the-art Performance Consulting through Executive Coaching, Change Management, Team Building, Organizational and Career Management services. Contact Rick Hernandez, President and CEO at contactus@syntesisglobal.com


Ameriprise Financial

D. F. Rick Speidel, Financial Advisor
Managing Director
Ameriprise Financial Services, Inc.
3027 Townsgate Rd Suite 200
Westlake Village, CA 91361-5863
O: 805.367.9015|F: 805.277.5156
Toll Free: 866.301.0449
CA Insurance License #0A01366
www.ameripriseadvisors.com/denny.f.speidel

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